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acpl-k43t, acpl-k44t automotive r 2 coupler tm wide operating temperature 1mbd digital optocoupler in a stretched 8-pin surface mount plastic package data sheet caution: it is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by esd. lead (pb) free rohs 6 fully compliant rohs 6 fully compliant options available; -xxxe denotes a lead-free product description the acpl-k43t is a single channel, high temperature, high cmr, high speed digital optocoupler in an eight lead miniature footprint specifi cally used in the automotive applications. the acpl-k44t is a dual channel equiva- lent of the acpl-k43t. both products are available in the stretched so-8 package outline, designed to be compat- ible with standard surface mount processes. this digital optocoupler uses an insulating layer between the light emitting diode and an integrated photo detector to provide electrical insulation between input and output. separate connections for the photodiode bias and output transistor collector increase the speed up to a hundred times over that of a conventional photo-transistor coupler by reducing the base-collector capacitance. avago r 2 coupler isolation products provide with rein- forced insulation and reliability that delivers safe signal isolation critical in automotive and high temperature industrial applications. functional diagram note: the connection of a 0.1 ? f bypass capacitor between pins 5 and 8 is recommended. features ?? high temperature and reliability low speed digital interface for automotive application ?? ultra low drive for status feedback at i f = 0.8 ma or 1.5 ma ?? 30 kv/ ? s (typ) high common-mode rejection at v cm = 1500 v ?? compact, auto-insertable stretched so8 packages ?? qualifi ed to aec q100 grade 1 test guidelines ?? wide operating temperature range: -40 c to +125 c ?? high speed: 1 mbd ?? low propagation delay: 1 ? s max. at i f = 10 ma ?? worldwide safety approval: C ul 1577 approval, 5 kv rms /1 min. C csa approval C iec/en/din en 60747-5-5 applications ?? automotive ipm driver for dc-dc converters and motor inverters ?? status feedback and wake-up signal isolation ?? canbus and spi communications interface ?? high temperature digital/analog signal isolation truth table led vo on low off high 7 1 2 3 45 6 8 anode cathode nc nc v cc v o nc gnd acpl-k43t 7 1 2 3 45 6 8 anode 1 cathode 1 cathode 2 anode 2 v cc v o1 v o2 gnd acpl-k44t
2 ordering information specify part number followed by option number (if desired). part number option (rohs compliant) package surface mount tape & reel ul 5000 v rms / 1 minute rating iec/en/din en 60747-5-5 quantity acpl-k43t -000e stretched so-8 x x 80 per tube -060e x x x 80 per tube -500e x x x 1000 per reel -560e x x x x 1000 per reel acpl-k44t -000e stretched so-8 x x 80 per tube -060e x x x 80 per tube -500e x x x 1000 per reel -560e x x x x 1000 per reel to order, choose a part number from the part number column and combine with the desired option from the option column to form an order entry. example 1: acpl-k43t-560e to order product of sso-8 surface mount package in tape and reel packaging with iec/en/din en 60747-5-5 safety approval in rohs compliant. option datasheets are available. contact your avago sales representative or authorized distributor for information. acpl-k43t i f shield 8 7 v cc 1 3 v o v cc v o1 i cc v f i o anode cathode + C 5 gnd acpl-k44t 8 7 1 2 v f1 i o1 + C i f1 i cc 3 4 v f2 i o2 v o2 6 C + i f2 gnd 5 use of 0.1 p f bypass capacitor connected between pins 5 and 8 is recommended. schematic
3 package outline dimensions (stretched so8) recommended pb-free ir profi le recommended refl ow condition as per jedec standard, j-std-020 (latest revision). note: non-halide fl ux should be used. regulatory information the acpl-k43t and acpl-k44t are approved by the following organizations: ul ul 1577, component recognition program up to v iso = 5 kv rms . csa csa component acceptance notice #5. iec/en/din en 60747-5-5 iec 60747-5-5 en 60747-5-5 din en 60747-5-5 5.850 0.254 (0.230 0.010) 5 6 7 8 4 3 2 1 dimensions in millimeters and (inches). note: lead coplanarity = 0.1 mm (0.004 inches). floating lead protrusion = 0.25mm (10mils) max. 6.807 0.127 (0.268 0.005) recommended land pattern 12.650 (0.498) 1.905 (0.075) 3.180 0.127 (0.125 0.005) 0.381 0.127 (0.015 0.005) 1.270 (0.050) bsg 7 0.254 0.100 (0.010 0.004) 0.750 0.250 (0.0295 0.010) 11.50 0.250 (0.453 0.010) 1.590 0.127 (0.063 0.005) 0.450 (0.018) 45 rohs-compliance indicator 0.64 (0.025) 0.200 0.100 (0.008 0.004) part number date code kxxt yww ee extended datecode for lot tracking
4 iec/en/din en 60747-5-5 insulation related characteristic (option 060e and 560e) description symbol characteristic units installation classifi cation per din vde 0110/1.89, table 1 for rated mains voltage 150 v rms for rated mains voltage 300 v rms for rated mains voltage 450 v rms for rated mains voltage 600 v rms for rated mains voltage 1000 v rms i C iv i C iv i C iv i C iv i C iii climatic classifi cation 55/100/21 pollution degree (din vde 0110/1.89) 2 maximum working insulation voltage v iorm 1140 v peak input to output test voltage, method b* v iorm x 1.875 = v pr , 100% production test with t m = 1 sec, partial discharge < 5 pc v pr 2137 v peak input to output test voltage, method a* v iorm x 1.6 = v pr , type and sample test, t m = 10 sec, partial discharge < 5 pc v pr 1824 v peak highest allowable overvoltage (transient overvoltage t ini = 60 sec) v iotm 8000 v peak safety limiting values (maximum values allowed in the event of a failure) case temperature input current output power t s i s, input p s, output 175 230 600 c ma mw insulation resistance at t s , v io = 500 v r s >10 9 ? insulation and safety related specifi cations parameter symbol acpl-k43t acpl-k44t units conditions minimum external air gap (clearance) l(101) 8 mm measured from input terminals to output terminals, shortest distance through air. minimum external tracking (creepage) l(102) 8 mm measured from input terminals to output terminals, shortest distance path along body. minimum internal plastic gap (internal clearance) 0.08 mm through insulation distance conductor to conductor, usually the straight line distance thickness between the emitter and detector. tracking resistance (comparative tracking index) cti 175 v din iec 112/vde 0303 part 1 isolation group (din vde0109) iiia material group (din vde 0109)
5 absolute maximum ratings parameter symbol min. max. units note storage temperature t stg -55 150 c operating ambient temperature t a -40 125 c average forward input current i f(avg) 20 ma peak forward input current (50% duty cycle, 1 ms pulse width) i f(peak) 40 ma peak transient input current ( 1 ? s pulse width, 300 ps) i f(trans) 100 ma reversed input voltage v r 5v input power dissipation (per channel) p in 30 mw output power dissipation p o 100 mw average output current i o 8ma peak output current i o(pk) 16 ma supply voltag v cc -0.5 30 v output voltage v o -0.5 20 v lead soldering cycle temperature 260 c time 10 s recommended operating conditions parameter symbol min. max. units note supply voltage v cc 20 v operating temperature t a -40 125 c electrical specifi cations (dc) over recommended operating t a = -40 c to 125 c, unless otherwise specifi ed parameter sym. min. typ. max. units test conditions fig. note current transfer ratio ctr 32 65 100 % t a = 25 c v cc = 4.5 v, v o = 0.4 v, i f = 10 ma 1, 2, 4 1 24 65 33 160 v cc = 4.5 v, v o = 0.4 v, i f = 1.5 ma 25 165 v cc = 4.5 v, v o = 0.4 v, i f = 0.8 ma logic low output voltage v ol 0.1 0.5 v v cc = 4.5 v, i o = 2.4 ma, i f = 10 ma 0.1 v cc = 4.5 v, i o = 0.5 ma, i f = 1.5 ma 0.1 v cc = 4.5 v, i o = 0.2 ma, i f = 0.8 ma logic high output current i oh 3x10 -5 0.5 ? a t a = 25 c v o = v cc = 5.5 v i f = 0 ma 11, 12 8x10 -5 5v o = v cc = 20 v logic low supply current (per channel) i ccl 85 200 ? a i f = 10 ma, v o = open, v cc = 20 v 15 i f = 1.5 ma, v o = open, v cc = 20 v logic high supply current (per channel) i cch 0.02 1 ? a t a = 25 c i f = 10 ma, v o = open, v cc = 20 v 2.5 input forward voltage v f 1.45 1.55 1.75 v t a = 25 c i f = 10 ma 3 1.25 1.55 1.85 input reversed breakdown voltage bv r 5v i r = 10 ? a temperature coeffi cient of forward voltage ? v f / ? t a -1.5 mv/c i f =10 ma -1.8 i f =1.5 ma input capacitance c in 90 pf f = 1 mhz, v f = 0
6 switching specifi cations (ac) over recommended operating (t a = -40 c to 125 c), v cc = 5.0 v unless otherwise specifi ed. parameter symbol min typ max units test conditions fig. note propagation delay time to logic low at output t phl 0.07 0.15 0.8 ? s t a = 25 c i f = 10 ma, r l = 1.9 k ? pulse: f = 10 khz, duty cycle = 50%, v cc = 5.0 v, c l = 15 pf, v thhl = 1.5 v 5, 6, 7, 8, 9, 10, 13 2, 3 0.06 1.0 0.7 5 i f = 1.5 ma, r l = 10 k ? 110 i f = 0.8 ma, r l = 27 k ? propagation delay time to logic high at output t plh 0.15 0.5 0.8 ? s t a = 25 c i f = 10 ma, r l = 1.9 k ? pulse: f = 10 khz, duty cycle = 50%, v cc = 5.0 v, c l = 15 pf, v thhl = 2.0 v 5, 6, 7, 8, 9, 10, 13 2, 3 0.03 1.0 0.9 5 i f = 1.5 ma, r l = 10 k ? 210 i f = 0.8 ma, r l = 27 k ? pulse width distortion pwd 0.35 0.45 ? s t a = 25 c pulse: f = 10 khz, duty cycle = 50%, i f = 10 ma, v cc = 5.0 v, r l = 1.9 k ? , c l = 15 pf, v thhl = 1.5 v, v thlh = 2.0 v 2, 3, 4 0.85 propagation delay diff erence between any 2 parts pdd 0.35 0.5 ? s t a = 25 c pulse: f = 10 khz, duty cycle = 50%, i f = 10 ma, v cc = 5.0 v, r l = 1.9 k ? , c l = 15 pf, v thhl = 1.5 v, v thlh = 2.0 v 2, 3, 5 0.9 common mode transient immunity at logic high output |cm h |1530? kv/ ? s ?i f = 0 ma v cm = 1500 v p-p , r l = 1.9 k ? , v cc = 5 v, t a = 25 c 14 6 common mode transient immunity at logic low output |cm l |1530? kv/ ? s ?i f = 10 ma common mode transient immunity at logic high output |cm h |5? kv/ ? s ?i f = 0 ma v cm = 1500 v p-p , r l = 10 k ? , v cc = 5 v, t a = 25 c 14 6 common mode transient immunity at logic low output |cm l |5? kv/ ? s ?i f = 1.5 ma package characteristics parameter symbol min. typ. max. units test conditions fig. note input-output momentary withstand voltage * v iso 5000 v rms rh 50%, t = 1 min., t a = 25 c 7, 8 input-output resistance r i-o 10 14 ? v i-o = 500 vdc 7 input-output capacitance c i-o 0.6 pf f = 1 mhz, v i-o = 0 vdc 7 * the input-output momentary withstand voltage is a dielectric voltage rating that should not be interpreted as an input-output continuous voltage rating. notes: 1. current transfer ratio in percent is defi ned as the ratio of output collector current, i o , to the forward led input current, i f , times 100. 2. use of a 0.1 ? f bypass capacitor connected between pins 5 and 8 is recommended. 3. the 1.9 k ? load represents 1 ttl unit load of 1.6 ma and the 5.6 k ? pull-up resistor. 4. pulse width distortion (pwd) is defi ned as |t phl C t plh | for any given device. 5. the diff erence between t plh and t phl between any two parts under the same test condition. 6. common transient immunity in a logic high level is the maximum tolerable (positive) dv cm /dt on the rising edge of the common mode pulse, v cm , to assure that the ouput will remain in a logic high state (i.e., v o > 2.0 v). common mode transient immunity in a logic low level is the maximum tolerable (negative) dv cm /dt on the falling edge of the common mode pulse signal, v cm to assure that the output will remain in a logic low state (i.e., v o < 0.8 v). 7. device considered a two terminal device: pins 1, 2, 3 and 4 shorted together, and pins 5, 6, 7 and 8 shorted together. 8. in accordance with ul 1577, each optocoupler is proof tested by applying an insulation test voltage > 6000 v rms for 1 second.
7 0 5 10 15 20 25 30 01020 v o - output voltage - v i o - output current - ma v cc = 5.0 v t a = 25 c 40 ma 35 ma 25 ma 15 ma 10 ma i f = 5 ma 0.6 0.7 0.8 0.9 1.0 1.1 -60 -20 20 60 100 140 normalized current transfer ratio t a - temperature - c 20 ma 30 ma normalized i f = 10 ma, v o = 0.4 v v cc = 5.0 v t a = 25 c 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0.1 1.0 10.0 100.0 i f - input current - ma normalized current transfer ratio 1.0 10.0 1.20 1.30 1.40 1.50 1.60 1.70 1.80 1.90 v f - forward voltage - v i f - forward current - ma t a = 125 c t a = 25 c t a = -40 c 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 -55 -15 -35 5 25 45 65 85 105 125 145 ambient temperature t a - c propagation delay time - s thl, vcc = 5 v tlh, vcc = 5 v thl, vcc = 3.3 v tlh, vcc = 3.3 v 0.2 0.0 0.4 0.6 0.8 1.0 1.2 -55 -15 -35 5 25 45 65 85 105 125 145 ambient temperature t a - c propagation delay time - s thl, vcc = 20 v tlh, vcc = 20 v thl, vcc = 15 v tlh, vcc = 15 v figure 1. dc and pulsed transfer characteristics figure 2. current transfer ratio vs. input current v o = 0.4 v, v cc = 5 v, t a = 25 c figure 3. input current vs. forward voltage f igure 4. current transfer ratio vs. temperature figure 5, propagation delay time vs. temperature i f = 10 ma, r l = 1.9 k ? , c l = 15 pf figure 6. propagation delay time vs. temperature i f = 10 ma, r l = 20 k ? , c l = 100 pf
8 0.0 0.5 1.0 1.5 2.0 2.5 3.0 12345678910 load resistance r l - k load resistance r l - k propagation delay t p - s propagation delay t p - s 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 5 101520253035404550 0.0 0.2 0.1 0.4 0.6 0.8 1.0 0.9 0.7 0.5 0.3 1.1 1.2 10 11 12 13 14 15 16 input current i f - ma input current i f - ma propagation delay t p - s propagation delay t p - s 0.0 0.2 0.3 0.1 0.4 0.6 0.8 1.0 1.1 0.9 0.7 0.5 1.2 10 11 12 13 14 15 16 thl, vcc = 5 v tlh, vcc = 5 v thl, vcc = 3.3 v tlh, vcc = 3.3 v thl, vcc = 5 v tlh, vcc = 5 v thl, vcc = 3.3 v tlh, vcc = 3.3 v thl, vcc = 20 v tlh, vcc = 20 v thl, vcc = 15 v tlh, vcc = 15 v thl, vcc = 20 v tlh, vcc = 20 v thl, vcc = 15 v tlh, vcc = 15 v 0 0.5 1 1.5 2 2.5 3 1.5 2 2.5 3 3.5 4 4.5 5 propagation delay tp ( s) input current i f (ma) thl, vcc = 5 v tlh, vcc = 5 v thl, vcc = 3.3 v tlh, vcc = 3.3 v thl, vcc = 5 v tlh, vcc = 5 v thl, vcc = 3.3 v tlh, vcc = 3.3 v 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 0.8 1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 2.8 3 propagation delay tp ( s) input current i f (ma) figure 7. propagation delay time vs. load resistance figure 8. propagation delay time vs. load resistance figure 9. propagation delay time vs. input current r l = 1.9 k ? , c l = 15 pf, t a = 25 c figure 10. propagation delay time vs. input current r l = 20 k ? , c l = 15 pf, t a = 25 c figure 10a. propagation delay time vs. input current r l = 10 k ? , c l = 15 pf, t a = 25 c figure 10b. propagation delay time vs. input current r l = 27 k ? , c l = 15 pf, t a = 25 c
9 i oh - logic high output - na 0.0001 0.001 0.01 0.1 1 10 100 1000 2 4 6 8 10 12 14 16 18 20 t a = -40 c t a = 25 c t a = 125 c v cc - supply voltage - v i f = 0 ma v cc = v o t a - temperature - c i oh - logic high output - na 0.0001 0.001 0.01 0.1 1 10 100 1000 -50 0 50 100 150 v o pulse gen. z o = 50 t r = 5 ns i f monitor i f 0.1 f r l c l = 15 pf 100 0 t phl t plh v o i f v ol 1.5 v 2.0 v 5 v +5 v 1 2 4 10% duty cycle 1/f < 100 s i f = 0 ma v cc = v o = 5 v 3 8 7 5 6 v o i f 0.1 f r l a b pulse gen. v cm + v ff v o v ol v o 0 v 10% 90% 90% 10% switch at a: i f = 0 ma switch at b: i f = 10 ma v cm t r t f 5 v v cc - 1500 v t r , t f = 80 ns 1 2 3 4 8 7 6 5 figure 11. logic high output current vs supply voltage figure 12. logic high output current vs temperature figure 13. switching test circuit figure 14. test circuit for transient immunity and typical waveforms
10 1 2 3 4 8 7 6 5 die1: led die2: detector figure 15. diagram of acpl-k43t for measurement thermal resistance model for acpl-k43t the diagram of acpl-k43t for measurement is shown in figure 15. here, one die is heated fi rst and the temperatures of all the dice are recorded after thermal equilibrium is reached. then, the 2 nd die is heated and all the dice temperatures are recorded. with the known ambient temperature, the die junction temperature and power dissipation, the thermal resistance can be calculated. the thermal resistance calculation can be cast in matrix form. this yields a 2 by 2 matrix for our case of two heat sources. r 11 r 12 x p 1 = ? t 1 r 21 r 22 p 2 ? t 2 r 11 : thermal resistance of die1 due to heating of die1 (?c/w) r 12 : thermal resistance of die1 due to heating of die2 (?c/w) r 21 : thermal resistance of die2 due to heating of die1 (?c/w) r 22 : thermal resistance of die2 due to heating of die2 (?c/w) p 1 : power dissipation of die1 (w) p 2 : power dissipation of die2 (w) t 1 : junction temperature of die1 due to heat from all dice (?c) t 2 : junction temperature of die2 due to heat from all dice (?c) t a : ambient temperature (?c) ? t 1 : temperature diff erence between die1 junction and ambient (?c) ? t 2 : temperature deference between die2 junction and ambient (?c) t 1 = (r 11 x p 1 + r 12 x p 2 ) + t a t 2 = (r 21 x p 1 + r 22 x p 2 ) + t a measurement data on a low k board: r 11 = 160 c/w, r 12 = r 21 = 74 c/w, r 22 = 115 c/w figure 16. diagram of acpl-k44t for measurement thermal resistance model for acpl-k44t the diagram of acpl-k44t for measurement is shown in figure 16. here, one die is heated fi rst and the temperatures of all the dice are recorded after thermal equilibrium is reached. then, the 2nd ,3rd and 4th die is heated and all the dice temperatures are recorded. with the known ambient t emperature, the die junction temperature and power dissipation, the thermal resistance can be calculated. the thermal resistance calculation can be cast in matrix form. this yields a 4 by 4 matrix for our case of two heat sources. r 11 r 12 r 13 r 14 x p 1 = ? t 1 r 21 r 22 r 23 r 24 p 2 ? t 2 r 31 r 32 r 33 r 34 p 3 ? t 3 r 41 r 42 r 43 r 44 p 4 ? t 4 r 11 : thermal resistance of die1 due to heating of die1 (?c/w) r 12 : thermal resistance of die1 due to heating of die2 (?c/w) r 13 : thermal resistance of die1 due to heating of die3 (?c/w) r 14 : thermal resistance of die1 due to heating of die4 (?c/w) r 21 : thermal resistance of die2 due to heating of die1 (?c/w) r 22 : thermal resistance of die2 due to heating of die2 (?c/w) r 23 : thermal resistance of die2 due to heating of die3 (?c/w) r 24 : thermal resistance of die2 due to heating of die4 (?c/w) 1 2 3 4 8 7 6 5 die1: led 1 die2: detector 1 die3: led 1 die4: detector 2
for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 2005-2012 avago technologies. all rights reserved. av02-3179en - june 20, 2012 r 31 : thermal resistance of die3 due to heating of die1 (?c/w) r 32 : thermal resistance of die3 due to heating of die2 (?c/w) r 33 : thermal resistance of die3 due to heating of die3 (?c/w) r 34 : thermal resistance of die3 due to heating of die4 (?c/w) r 41 : thermal resistance of die4 due to heating of die1 (?c/w) r 42 : thermal resistance of die4 due to heating of die2 (?c/w) r 43 : thermal resistance of die4 due to heating of die3 (?c/w) r 44 : thermal resistance of die4 due to heating of die4 (?c/w) p 1 : power dissipation of die1 (w) p 2 : power dissipation of die2. p 3 : power dissipation of die3 (w) p 4 : power dissipation of die4. t 1 : junction temperature of die1 due to heat from all dice (?c) t 2 : junction temperature of die2 due to heat from all dice (?c) t 3 : junction temperature of die3 due to heat from all dice (?c) t 4 : junction temperature of die4 due to heat from all dice (?c) t a : ambient temperature (?c) ? t 1 : temperature diff erence between die1 junction and ambient (?c) ? t 2 : temperature deference between die2 junction and ambient (?c) ? t 3 : temperature diff erence between die3 junction and ambient (?c) ? t 4 : temperature deference between die4 junction and ambient (?c) t 1 = (r11 x p1 + r12 x p2 + r13 x p3 + r14 x p4 ) + ta -- (1) t 2 = (r21 x p1 + r22 x p2 + r23 x p3 + r24 x p4) + ta -- (2) t 3 = (r31 x p1 + r32 x p2 + r33 x p3 + r34 x p4) + ta -- (3) t 4 = (r41 x p1 + r42 x p2 + r43 x p3 + r44 x p4 ) + ta -- (4) measurement data on a low k board: r 11 r 12 r 13 r 14 r 21 r 22 r 23 r 24 r 31 r 32 r 33 r 34 r 41 r 42 r 43 r 44 160 76 76 76 76 115 76 76 76 76 160 76 76 76 76 115

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